The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2014

Filed:

Dec. 13, 2010
Applicants:

Torsten Huisinga, Dresden, DE;

Jens Heinrich, Wachau, DE;

Kai Frohberg, Niederau, DE;

Frank Feustel, Dresden, DE;

Inventors:

Torsten Huisinga, Dresden, DE;

Jens Heinrich, Wachau, DE;

Kai Frohberg, Niederau, DE;

Frank Feustel, Dresden, DE;

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53295 (2013.01); H01L 23/5226 (2013.01); H01L 2221/1036 (2013.01); H01L 21/76807 (2013.01); H01L 23/53238 (2013.01); H01L 2221/1031 (2013.01); H01L 21/76801 (2013.01); H01L 21/76808 (2013.01); H01L 23/5329 (2013.01);
Abstract

In complex semiconductor devices, sophisticated ULK materials may be used in metal line layers in combination with a via layer of enhanced mechanical stability by increasing the amount of dielectric material of superior mechanical strength. Due to the superior mechanical stability of the via layers, reflow processes for directly connecting the semiconductor die and a package substrate may be performed on the basis of a lead-free material system without unduly increasing yield losses.


Find Patent Forward Citations

Loading…