The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Feb. 20, 2014
Applicant:

Globalfoundries, Inc., Grand Cayman, KY;

Inventors:

Oliver Mieth, Dresden, DE;

Carsten Peters, Dresden, DE;

Torsten Huisinga, Dresden, DE;

Assignee:

GLOBALFOUNDRIES, INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3105 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76826 (2013.01); H01L 21/76805 (2013.01); H01L 21/76829 (2013.01); H01L 21/76895 (2013.01); H01L 21/3105 (2013.01);
Abstract

Methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes densifying an upper-surface portion of an ILD layer of dielectric material that overlies a metallization layer above a semiconductor substrate to form a densified surface layer of dielectric material. The densified surface layer and the ILD layer are etched through to expose a metal line of the metallization layer.


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