Company Filing History:
Years Active: 2016
Title: Oliver Mieth - Innovator in Integrated Circuit Fabrication
Introduction
Oliver Mieth is a prominent inventor based in Dresden, Germany. He has made significant contributions to the field of integrated circuit fabrication. His innovative methods have paved the way for advancements in semiconductor technology.
Latest Patents
Oliver Mieth holds a patent titled "Methods for fabricating integrated circuits including densifying interlevel dielectric layers." This patent describes a method for fabricating an integrated circuit that involves densifying an upper-surface portion of an interlevel dielectric (ILD) layer of dielectric material. This layer overlies a metallization layer above a semiconductor substrate, forming a densified surface layer of dielectric material. The process includes etching through the densified surface layer and the ILD layer to expose a metal line of the metallization layer.
Career Highlights
Oliver Mieth is associated with GlobalFoundries Inc., a leading semiconductor manufacturer. His work focuses on enhancing the efficiency and performance of integrated circuits. With a patent portfolio that includes 1 patent, he continues to contribute to the advancement of technology in the semiconductor industry.
Collaborations
Some of his notable coworkers include Carsten Peters and Torsten Huisinga. Their collaborative efforts have further strengthened the innovative capabilities within their organization.
Conclusion
Oliver Mieth's contributions to integrated circuit fabrication exemplify the spirit of innovation in the semiconductor industry. His work continues to influence the development of advanced technologies.