Growing community of inventors

Dresden, Germany

Torsten Huisinga

Average Co-Inventor Count = 3.04

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 34

Torsten HuisingaRalf Richter (8 patents)Torsten HuisingaJens Heinrich (7 patents)Torsten HuisingaKai Frohberg (4 patents)Torsten HuisingaRobert Seidel (3 patents)Torsten HuisingaCarsten Peters (3 patents)Torsten HuisingaFrank Feustel (2 patents)Torsten HuisingaAxel Preusse (2 patents)Torsten HuisingaMichael Grillberger (2 patents)Torsten HuisingaAndreas Ott (2 patents)Torsten HuisingaJens Hahn (2 patents)Torsten HuisingaRonny Pfuetzner (2 patents)Torsten HuisingaMarkus Lenski (1 patent)Torsten HuisingaKatrin Reiche (1 patent)Torsten HuisingaKeith Donegan (1 patent)Torsten HuisingaRonny Pfutzner (1 patent)Torsten HuisingaOliver Mieth (1 patent)Torsten HuisingaTorsten Huisinga (19 patents)Ralf RichterRalf Richter (107 patents)Jens HeinrichJens Heinrich (30 patents)Kai FrohbergKai Frohberg (90 patents)Robert SeidelRobert Seidel (28 patents)Carsten PetersCarsten Peters (28 patents)Frank FeustelFrank Feustel (53 patents)Axel PreusseAxel Preusse (29 patents)Michael GrillbergerMichael Grillberger (13 patents)Andreas OttAndreas Ott (12 patents)Jens HahnJens Hahn (7 patents)Ronny PfuetznerRonny Pfuetzner (5 patents)Markus LenskiMarkus Lenski (58 patents)Katrin ReicheKatrin Reiche (13 patents)Keith DoneganKeith Donegan (12 patents)Ronny PfutznerRonny Pfutzner (2 patents)Oliver MiethOliver Mieth (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Globalfoundries Inc. (19 from 5,671 patents)


19 patents:

1. 9685497 - Embedded metal-insulator-metal capacitor

2. 9478602 - Method of forming an embedded metal-insulator-metal (MIM) capacitor

3. 9305878 - Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects

4. 9287109 - Methods of forming a protection layer to protect a metal hard mask layer during lithography reworking processes

5. 9257329 - Methods for fabricating integrated circuits including densifying interlevel dielectric layers

6. 8932911 - Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects

7. 8922023 - Semiconductor device comprising metallization layers of reduced interlayer capacitance by reducing the amount of etch stop materials

8. 8859418 - Methods of forming conductive structures using a dual metal hard mask technique

9. 8786088 - Semiconductor device including ultra low-K (ULK) metallization stacks with reduced chip-package interaction

10. 8673770 - Methods of forming conductive structures in dielectric layers on an integrated circuit device

11. 8598714 - Semiconductor device comprising through hole vias having a stress relaxation mechanism

12. 8536050 - Selective shrinkage of contact elements in a semiconductor device

13. 8492269 - Hybrid contact structure with low aspect ratio contacts in a semiconductor device

14. 8435841 - Enhancement of ultraviolet curing of tensile stress liner using reflective materials

15. 8399335 - Sophisticated metallization systems in semiconductors formed by removing damaged dielectric layers after forming the metal features

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