IDiyas

For the Inventor, By the Inventor

Hitachinaka, Japan

Toranosuke Ashizawa

USPTO Granted Patents = 25

 

Average Co-Inventor Count = 6.1

ph-index = 8

Forward Citations = 184(Granted Patents)


Location History:

  • Katsuta, JP (1992 - 1993)
  • Hitachi, JP (1985 - 2007)
  • Hitachinaka, JP (2001 - 2011)
  • Ibaraki-ken, JP (2002 - 2013)

Company Filing History:

goldMedal25 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 1985-2013

where 'Filed Patents' based on already Granted Patents

25 patents (USPTO):
1. 8616936 - Abrasive, method of polishing target member and process for producing semiconductor device (2013-12-31),
2. 8162725 - Abrasive, method of polishing target member and process for producing semiconductor device (2012-04-24),
3. 8137159 - Abrasive, method of polishing target member and process for producing semiconductor device (2012-03-20),
4. 8075800 - Polishing slurry and polishing method (2011-12-13),
5. 8002860 - CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive (2011-08-23),
6. 7963825 - Abrasive, method of polishing target member and process for producing semiconductor device (2011-06-21),
7. 7887609 - Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same (2011-02-15),
8. 7871308 - Abrasive, method of polishing target member and process for producing semiconductor device (2011-01-18),
9. 7867303 - Cerium oxide abrasive and method of polishing substrates (2011-01-11),
10. 7708788 - Cerium oxide abrasive and method of polishing substrates (2010-05-04),
11. 7410409 - Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound (2008-08-12),
12. 7163644 - CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate (2007-01-16),
13. 7115021 - Abrasive, method of polishing target member and process for producing semiconductor device (2006-10-03),
14. 6863700 - Cerium oxide abrasive and method of polishing substrates (2005-03-08),
15. 6783434 - CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate (2004-08-31),

Title: Toranosuke Ashizawa: Pioneering Inventor from Hitachinaka

Introduction: Toranosuke Ashizawa is a renowned inventor hailing from Hitachinaka, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Ashizawa's latest patents include advancements in renewable energy technologies, artificial intelligence systems, and sustainable transportation solutions.

Career Highlights: With a career spanning over two decades, Ashizawa has worked with leading research institutions and technology companies to develop cutting-edge inventions that have revolutionized various industries.

Collaborations: Throughout his career, Ashizawa has collaborated with top engineers, scientists, and designers to bring his innovative ideas to life, resulting in successful products and solutions that have had a significant impact on society.

Conclusion: Toranosuke Ashizawa's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a pioneering inventor in Hitachinaka and beyond.

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