Chandler, AZ, United States of America

Tong Wa Chao

This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignee: Intel Corporation. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tong Wa Chao. Retrieved from https://idiyas.com/inventor/tong-wa-chao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 83.3

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 28(Granted Patents)


Location History:

  • Chandler, AZ (US) (2011 - 2015)
  • San Jose, CA (US) (2021)

Company Filing History:


Years Active: 2011-2026

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6 patents (USPTO):Explore Patents

Title: Innovations of Tong Wa Chao in Thermal Management Technologies

Introduction

Tong Wa Chao is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of thermal management technologies, holding a total of 6 patents. His work primarily focuses on enhancing the efficiency of cooling systems for integrated circuits.

Latest Patents

Chao's latest patents include innovative technologies for isolated heat dissipating devices. One of his inventions discloses techniques for heat sinks and cold plates for compute systems. In this embodiment, a heat sink consists of two sub-heat sinks that are mechanically connected but thermally isolated. This design allows the two sub-heat sinks to independently cool different dies on the same integrated circuit component. Another embodiment features a system with an integrated circuit component cooled by a first water block and a second water block. The first water block forms a loop with a gap, while the second water block has a pedestal that extends through this gap to contact the integrated circuit component. This configuration enables independent cooling of different dies on the same integrated circuit component.

Additionally, Chao has developed reconfigurable thermal control systems for high-powered integrated circuitry. His modular assemblies for thermal management allow for scalable thermal performance based on power dissipation demands. The modularity facilitates retrofitting of deployed cooling systems according to current power dissipation requirements. In some embodiments, a modular assembly can be reversibly reconfigured to adjust cooling capacity and meet defined power dissipation targets. This includes a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be coupled or decoupled based on the power dissipation condition of the electronic component.

Career Highlights

Chao is currently employed at Intel Corporation, where he continues to innovate in the field of thermal management. His work has been instrumental in advancing technologies that improve the efficiency and effectiveness of cooling systems in computing devices.

Collaborations

Some of his notable coworkers include Prabhakar Subrahmanyam and Ridvan A Sahan, who have collaborated with him on various projects within Intel Corporation.

Conclusion

Tong Wa Chao's contributions to thermal management technologies have significantly impacted the efficiency of cooling systems in integrated circuits. His innovative patents reflect a deep understanding of the challenges in this field and offer practical solutions for modern computing needs.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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