The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Mar. 06, 2021
Intel Corporation, Santa Clara, CA (US);
Prabhakar Subrahmanyam, San Jose, CA (US);
Tong Wa Chao, San Jose, CA (US);
Ying-Feng Pang, San Jose, CA (US);
Yi Xia, Campbell, CA (US);
Rahima K. Mohammed, San Jose, CA (US);
Victor P. Polyanko, San Jose, CA (US);
Ridvan A. Sahan, Sunnyvale, CA (US);
Guangying Zhang, Shanghai, CN;
Guoliang Ying, Shanghai, CN;
Chuanlou Wang, Shanghai, CN;
Jun Lu, Shanghai, CN;
Liguang Du, Shanghai, CN;
Peng Wei, Shangha, CN;
Xiang Que, Shanghai, CN;
Intel Corporation, Santa Clara, CA (US);
Abstract
Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.