Company Filing History:
Years Active: 2020-2025
Title: Innovations of Liguang Du in Heat Dissipation Technologies
Introduction
Liguang Du is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of heat dissipation technologies, particularly in the context of integrated circuit components. With a total of 4 patents to his name, Du's work has been instrumental in advancing the efficiency of cooling systems in computing.
Latest Patents
Du's latest patents include innovative technologies for isolated heat dissipating devices. One notable invention involves techniques for heat sinks and cold plates for compute systems. In this embodiment, a heat sink comprises two sub-heat sinks that are mechanically connected but thermally isolated. This design allows the two sub-heat sinks to independently cool different dies on the same integrated circuit component. Another embodiment features a system that includes an integrated circuit component cooled by a first water block and a second water block. The first water block forms a loop with a gap, while the second water block has a pedestal extending through this gap to contact the integrated circuit component. This configuration enables independent cooling of different dies on the same integrated circuit component.
Additionally, Du has developed a package protector with an integrated guide pin. This apparatus facilitates the alignment of computer component connectors. The package protector includes a body that partially surrounds an integrated circuit package of a circuit card when mounted. It also features a guide pin component that extends from the body, allowing for precise alignment with the header of the circuit card.
Career Highlights
Liguang Du is currently employed at Intel Corporation, where he continues to innovate in the field of thermal management solutions. His work has garnered attention for its practical applications in enhancing the performance of computing systems.
Collaborations
Du has collaborated with notable colleagues, including Guoliang Ying and Na Chen, who have contributed to his research and development efforts.
Conclusion
Liguang Du's contributions to heat dissipation technologies reflect his commitment to advancing the field of integrated circuit cooling. His innovative patents demonstrate a deep understanding of thermal management, making him a valuable asset in the tech industry.