The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Dec. 29, 2016
Intel Corporation, Santa Clara, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Aspects of the embodiments are directed to a printed circuit board (PCB) that includes a conductive layer extending from the printed circuit board to act as a heat sink for circuit components electrically and mechanically attached to the PCB. The conductive layer can be a copper ground layer of a multi-layered PCB. The PCB can include one or more circuit components, such as dynamic random access memory elements. In embodiments, the PCB is part of a dual inline memory module. The conductive layer can be fashioned such that it extends out from the PCB and returns over the circuit elements to define an air gap between the conductive layer and the surface of the PCB and/or the surface of the circuit elements. In embodiments, a connection adaptor can be used to accommodate various PCB thicknesses so that the PCB can be electrically connected to an edge connector.