The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Jun. 22, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jun Lu, Shanghai, CN;

Wei Liao, Shanghai, CN;

Guangying Zhang, Shanghai, CN;

Liguang Du, Shanghai, CN;

Guoliang Ying, Shanghai, CN;

Fangbo Zhu, Shanghai, CN;

Song Kok Hang, Fremont, CA (US);

Juan A. Orozco Ramirez, Zapopan JAL, MX;

Wesley B. Morgan, Olympia, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/70 (2011.01); G06F 1/18 (2006.01); H01R 13/627 (2006.01);
U.S. Cl.
CPC ...
H01R 12/7005 (2013.01); G06F 1/185 (2013.01); H01R 13/6278 (2013.01); H01R 2201/06 (2013.01);
Abstract

Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.


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