Company Filing History:
Years Active: 2021-2022
Title: Innovations by Fangbo Zhu: Pioneering Advanced Vapor Chamber Technologies
Introduction: Fangbo Zhu is a prominent inventor based in Shanghai, China, known for his significant contributions to the field of thermal management and electronic packaging. With a total of two patents to his name, Zhu has developed innovative solutions that facilitate better efficiency and alignment in technological systems.
Latest Patents: Fangbo Zhu's latest patents showcase his expertise in vapor chamber technology and connector alignment systems. One of his patents is titled "Moderated deformation of a vapor chamber to match a shape of a heat source." This invention involves a vapor chamber designed to thermally couple to both a heat sink and a heat source, utilizing a compressible mechanism that allows the vapor chamber to deform partially to fit the specific shape of the heat source, ensuring effective thermal management. His other patent, "Package protector with integrated guide pin," focuses on enhancing the alignment of computer component connectors. This device includes a protective body for integrated circuit packages that features a guide pin component, which aids in aligning connectors with the circuit card's header during installation.
Career Highlights: Fangbo Zhu has made notable strides in his career as an inventor at Intel Corporation, a leading technology company recognized for its pioneering work in semiconductor design and manufacturing. His role at Intel has allowed him to leverage advanced research and development opportunities to bring his innovations to fruition.
Collaborations: During his tenure at Intel, Fangbo Zhu has worked alongside talented colleagues, including Jun Lu and Wei Liao. These collaborations have facilitated the exchange of ideas and knowledge, further enriching the innovative environment at the company and leading to breakthroughs in technology.
Conclusion: Fangbo Zhu stands out as a key inventor whose contributions to vapor chamber technology and electronic component alignment systems are shaping future advancements in the industry. With a passion for innovation, his work at Intel Corporation continues to influence the development of efficient thermal management solutions and improve the reliability of electronic devices.