The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Sep. 28, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Guoliang Ying, Shanghai, CN;

Jun Lu, Shanghai, CN;

Guangying Zhang, Shanghai, CN;

Xinglong Xu, Shanghai, CN;

Wei Liao, Shanghai, CN;

Fangbo Zhu, Shanghai, CN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/02 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 21/50 (2013.01); H01L 23/02 (2013.01); H01L 23/367 (2013.01); H01L 23/562 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Systems, apparatuses, processes, and techniques are provided which are related to a vapor chamber () having a first side and a second side opposite the first side, where the first side is to thermally couple to a heat sink () and the second side to thermally couple to a heat source. The vapor chamber () may include a compressible mechanism disposed within the vapor chamber () coupled with the first side and the second side where the second side, when coupled to the heat source, is to deform at least partially to match a shape of the heat source. The compressible mechanism within the vapor chamber () may moderate the deformation of the second side.


Find Patent Forward Citations

Loading…