The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Jan. 12, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Tao Shu, Shanghai, CN;

Chuansheng Liu, Shanghai, CN;

Na Chen, Shanghai, CN;

Liguang Du, Shanghai, CN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); F28D 15/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); F28D 15/0275 (2013.01); H05K 7/20009 (2013.01); H05K 7/2039 (2013.01); H05K 7/20336 (2013.01); H05K 7/20727 (2013.01); G06F 2200/201 (2013.01);
Abstract

Embodiments described herein may include apparatuses, systems and/or processes to provide cooling to a heat source. In embodiments, a first set of cooling fins are thermally coupled to a heat source in a first orientation to allow first airflow to pass through in between the first set of cooling fins to dissipate heat from the heat source. A second set of cooling fins thermally coupled to the heat source in a second orientation to allow second airflow to pass through in between the second set of cooling fins to dissipate heat from the heat source. A barrier may be coupled to the second set of cooling fins to substantially divert the second airflow away from the first airflow about to pass through in between the first set of cooling fins so that pre-heated air does not flow over the first set of cooling fins.


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