This inventor holds 1 USPTO granted patent and 7 published patent applications and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2021.
Company Filing History:
Years Active: 2021
Title: Innovations by Chuansheng Liu in Heat Dissipation Technology
Introduction
Chuansheng Liu is a notable inventor based in Shanghai, China. He has made significant contributions to the field of heat dissipation technology. His innovative approach focuses on enhancing cooling efficiency for heat sources.
Latest Patents
Chuansheng Liu holds a patent for "Heat dissipation using airflow diversion with cooling fins." This invention includes apparatuses, systems, and processes designed to provide effective cooling to a heat source. The patent describes a first set of cooling fins that are thermally coupled to a heat source in a first orientation, allowing airflow to pass through and dissipate heat. Additionally, a second set of cooling fins is thermally coupled in a different orientation, facilitating a second airflow to further enhance heat dissipation. A barrier is incorporated to divert the second airflow away from the first, ensuring that pre-heated air does not interfere with the cooling process.
Career Highlights
Chuansheng Liu is currently employed at Intel Corporation, where he continues to innovate in the field of thermal management. His work is pivotal in developing technologies that improve the efficiency of electronic devices.
Collaborations
He collaborates with talented colleagues, including Tao Shu and Na Chen, who contribute to his research and development efforts.
Conclusion
Chuansheng Liu's contributions to heat dissipation technology exemplify the importance of innovation in enhancing electronic device performance. His patent reflects a significant advancement in cooling solutions, showcasing his expertise and commitment to the field.