The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Dec. 18, 2007
Applicants:
Ajit V. Sathe, Chandler, AZ (US);
Mat J. Manusharow, Phoenix, AZ (US);
Tong WA Chao, Chandler, AZ (US);
Inventors:
Ajit V. Sathe, Chandler, AZ (US);
Mat J. Manusharow, Phoenix, AZ (US);
Tong Wa Chao, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H05K 3/30 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H05K 3/303 (2013.01); H01L 23/50 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/2018 (2013.01); H05K 2204/2036 (2013.01); H01L 2224/16 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments, the stiffening element is attached to the underlying circuit board. Other embodiments are described and claimed.