This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Mat J. Manusharow: Inventor of an Integrated Circuit Package Stiffener.
Introduction
Mat J. Manusharow is an inventor associated with Intel Corporation in Phoenix, Arizona. His patent work addresses integrated circuit packaging and the mechanical support of electronic components.
Latest Patents
Manusharow is named on 1 patent: “Integrated Circuit Package Having Bottom-Side Stiffener.” The patent describes a stiffening element positioned between an integrated circuit package and an underlying circuit board. In some embodiments, the element is attached to the circuit board. The disclosed designs aim to provide structural support for the package, and the patent also describes other embodiments.
Career Highlights
Manusharow’s listed invention concerns the design of integrated circuit packages and their interaction with circuit boards. His work is associated with Intel Corporation, a company known for developing semiconductor technologies.
Collaborations
Manusharow’s listed coworkers include Tong Wa Chao and Ajit V. Sathe. Their shared association reflects collaborative work connected to semiconductor packaging and related technologies.
Conclusion
Mat J. Manusharow’s patent highlights an approach to strengthening integrated circuit packages through a bottom-side stiffener, contributing to the broader field of semiconductor packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile