Intel Corporation

Tong Wa Chao

Prabhakar Subrahmanyam

Ying-Feng Pang

Ridvan A Sahan

Jun Lu

Ajit V Sathe

Yi Xia

Victor Polyanko

Guoliang Ying

Rahima K Mohammed

Liguang Du

Guangying Zhang

Mat J Manusharow

Stephanie L Seaman

Chuanlou Wang

Peng Wei

Xiang Que

Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

Technologies for isolated heat dissipating devices

Modular assemblies for thermal management are provided. Modularity permits or facilitates scalable thermal performance with respect to power dissipation demands. Modularity also permits retrofitting a deployed cooling system based at least on a current power dissipation requirement. In some embodiments, a modular assembly can be reversibly reconfigured in order to adjust cooling capacity and fulfill a defined power dissipation target. In some embodiments, a modular assembly can include a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be reversibly coupled to or reversibly decoupled from the liquid-cooled pedestal based at least on a power dissipation condition and/or a change thereof of a dissipative electronic component. The reversible coupling and reversible decoupling of the attachment members can permit or otherwise facilitate reversibly adjusting the heat transfer between the modular assembly and the dissipative electronic component. Scalability of thermal performance of the modular assembly can be achieved, at least in part, by the addition of liquid-cooled attachment members.

Reconfigurable thermal control of high-powered integrated circuitry

Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.

Reconfigurable cooling assembly for integrated circuitry

Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments, the stiffening element is attached to the underlying circuit board. Other embodiments are described and claimed.

Integrated circuit package having bottom-side stiffener

Embodiments of a heat spreader and an assembly including such a heat spreader are disclosed. The heat spreader includes a stiffening member, which in one embodiment comprises a wall extending from a lower surface of the heat spreader. The wall may be coupled with a substrate, and the addition of this wall may decrease warpage of the substrate and increase package stiffness. The wall may be located between adjacent integrated circuit die that are disposed on the substrate. Other embodiments are described and claimed.

Heat spreader for a multi-chip package

Growing community of inventors

Chandler, AZ, United States of America

Tong Wa Chao