Enter inventor name

Todd O Bolken

This inventor holds 95 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging (CPC class H01L2-144). Top assignees: Micron Technology Incorporated, Round Rock Research, LLC, Other. Active years: 1999-2022.

USPTO Granted Patents = 95 (Patent Applications = 1)

% Patents Active = 72.6

Average Co-Inventor Count = 1.8

ph-index = 22

Forward Citations = 1,468(Granted Patents)

Forward Citations (Not Self Cited) = 1,292(Dec 10, 2025)

Inventors with similar research interests:

🔬 See more inventors

Location History:

Meridian, ID (US) (1999 - 2010)
Star, ID (US) (2004 - 2017)
Eale, ID (US) (2018)
Eagle, ID (US) (2012 - 2022)

Company Filing History:

90 out of 39,149

Micron Technology Incorporated

patents

3 out of 428

Round Rock Research, LLC

patents

2 out of 834,411

Other

patents

Years Active: 1999-2022

Loading Chart...

Areas of Expertise:

Semiconductor Device Assembly

Through-Package Interconnect

Thermal Conductivity

Optically Interactive Devices

Molded Casing

Ball Grid Array

Image Sensitive Devices

Multi-Chip Substrate

Transfer Molding

Encapsulated Dice

Device Components

Packaging Techniques

95 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11456286 - Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods (2022-09-27),

2. 10615154 - Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods (2020-04-07),

3. 9978730 - Method of assembly semiconductor device with through-package interconnect (2018-05-22),

4. 9559087 - Techniques for packaging multiple device components (2017-01-31),

5. 9508686 - Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods (2016-11-29),

6. 8906743 - Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods (2014-12-09),

7. 8709878 - Methods of packaging imager devices and optics modules, and resulting assemblies (2014-04-29),

8. 8629558 - Techniques for packaging multiple device components (2014-01-14),

9. 8624371 - Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor (2014-01-07),

10. 8508034 - Electronic devices (2013-08-13),

11. 8426954 - Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor (2013-04-23),

12. 8212348 - Techniques for packaging multiple device components (2012-07-03),

13. 8115296 - Electronic device package (2012-02-14),

14. 8110884 - Methods of packaging imager devices and optics modules, and resulting assemblies (2012-02-07),

15. 8008762 - Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor (2011-08-30),

As an AI assistant specialized in innovations, inventions, inventors, patent attorneys, assignees, and patents, I will create an article about inventor Todd O Bolken.

Title: Todd O Bolken: Pioneering Inventor Inspiring Future Generations

Introduction:

Inventor Todd O Bolken, hailing from Star, ID (US), is renowned for his passion for innovation and relentless drive to create. His impressive legacy as a pioneering inventor continues to inspire future generations to think outside the box and pursue their inventive dreams.

Latest Patents:

Todd O Bolken holds an impressive number of 95 patents, showcasing his dedication to pushing the boundaries of innovation. Among his latest patents is the "Semiconductor Device Assembly with Through-Package Interconnect and Associated Systems, Devices, and Methods." These methods revolutionize semiconductor device manufacturing by incorporating spacer materials and interconnects to enhance electrical connections.

Career Highlights:

Throughout his career, Todd O Bolken has made significant contributions to the field of technology. He has worked with reputable companies such as Micron Technology Incorporated and Round Rock Research, LLC, where he honed his skills and expertise in semiconductor technology.

Collaborations:

Collaboration plays a vital role in driving innovation forward, and Todd O Bolken has had the privilege of working alongside talented individuals in his field. Some of his notable coworkers include Chad A Cobbley and Cary J Baerlocher, who have contributed to the success of various projects with their expertise.

Conclusion:

Todd O Bolken's innovative spirit and numerous patents solidify his position as a trailblazing inventor. His dedication to pushing the boundaries of technology serves as an inspiration to aspiring inventors worldwide, encouraging them to pursue their inventive dreams with passion and determination, just like Todd O Bolken.

Profile summary based on public USPTO records.

Please report any incorrect information to [email protected]