This inventor holds 4 USPTO granted patents and 11 published patent applications. Top assignees: Boe Technology Group, Hefei Boe Ruisheng Technology Co., Ltd.. Active years: 2026.
Company Filing History:
4 out of 1,379 
4 out of 14 Years Active: 2026
Title: Tingwei Han: Innovator in Wiring Substrate Technology
Introduction
Tingwei Han is a notable inventor based in Beijing, China. He has made significant contributions to the field of electronic devices, particularly through his innovative patent related to wiring substrates. His work reflects a deep understanding of electronic engineering and design.
Latest Patents
Tingwei Han holds a patent for a wiring substrate and electronic device. This invention includes a substrate with a first pad group, where each group contains an output pad. Additionally, it features a constant voltage signal line located on the same side of the substrate as the first pad group. The design also incorporates second pad groups, which consist of multiple sub-pad groups connected in parallel, with each sub-pad group containing several pad regions connected in series. This patent showcases his expertise in enhancing electronic device functionality.
Career Highlights
Throughout his career, Tingwei Han has worked with prominent companies in the technology sector. He has been associated with Hefei Boe Ruisheng Technology Co., Ltd. and Boe Technology Group. His experience in these organizations has allowed him to develop and refine his skills in electronic device innovation.
Collaborations
Tingwei Han has collaborated with several professionals in his field, including Zouming Xu and Jie Wang. These partnerships have contributed to his success and the advancement of technology in wiring substrates.
Conclusion
Tingwei Han is a distinguished inventor whose work in wiring substrate technology has made a significant impact in the electronics industry. His innovative patent and collaborations highlight his contributions to advancing electronic devices.