The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

May. 20, 2022
Applicants:

Hefei Boe Ruisheng Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Tingwei Han, Beijing, CN;

Zouming Xu, Beijing, CN;

Jie Wang, Beijing, CN;

Xintao Wu, Beijing, CN;

Jiawei Xu, Beijing, CN;

Ningyu Luo, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 70/611 (2026.01); H10W 90/00 (2026.01);
Abstract

Provided are a wiring substrate and an electronic device, the wiring substrate includes a substrate; first pad group, arranged on the substrate, each of the first pad group including an output pad; a constant voltage signal line, arranged on a same side of the substrate as the first pad group; and second pad groups, including a plurality of sub-pad groups connected in parallel, each of the sub-pad groups including a plurality of pad regions connected in series.


Find Patent Forward Citations

Han, Tingwei. (2026). Wiring substrate and electronic device (U.S. Patent No. 12642112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12642112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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