The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Jul. 22, 2022
Applicants:

Hefei Boe Ruisheng Technology Co., Ltd., Hefei, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Jiawei Xu, Beijing, CN;

Zouming Xu, Beijing, CN;

Xintao Wu, Beijing, CN;

Xiaoxiang Zhang, Beijing, CN;

Jie Wang, Beijing, CN;

Ningyu Luo, Beijing, CN;

Tingwei Han, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/0284 (2013.01);
Abstract

A wiring substrate includes a base substrate, a plurality of constant voltage signal lines and a plurality of first connection lines, and a plurality of first pad regions. Each of the first pad regions includes a plurality of sub-regions. Each of the sub-regions includes a plurality of pad groups. The plurality of pad groups include at least a first pad group and a last pad group. An orthographic projection of one of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the constant voltage signal lines on the base substrate. An orthographic projection of the other of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the first connection lines on the base substrate.


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