The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
May. 19, 2022
Hefei Boe Ruisheng Technology Co., Ltd., Anhui, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Xintao Wu, Beijing, CN;
Zouming Xu, Beijing, CN;
Jie Wang, Beijing, CN;
Jiawei Xu, Beijing, CN;
Ningyu Luo, Beijing, CN;
Tingwei Han, Beijing, CN;
Yuan Li, Beijing, CN;
Hefei BOE Ruisheng Technology Co., Ltd., Hefei, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
Provided are a wiring substrate and an electronic device. The wiring substrate includes a substrate; a first pad group on the substrate, the first pad group including a power supply pad and an output pad; a power signal line on the same side of the substrate as the first pad groups, the power signal line coupled with the power supply pads; a second pad group, arranged on the same side of the substrate as the first pad group, the second pad group including a plurality of sub-pad groups connected with each other, each sub-pad group at least including a first sub-pad and a second sub-pad, a first sub-pad in at least one of the plurality of sub-pad groups is coupled with the power signal line, and a second sub-pad in at least one of the plurality of sub-pad groups is coupled with the output pad of one first pad group.