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For the Inventor, By the Inventor

Tainan, Taiwan

Ting-Li Yang

This inventor holds 20 USPTO granted patents and 14 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., International Business Machines Corporation. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting-Li Yang. Retrieved from https://idiyas.com/inventor/ting-li-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 95.0

Average Co-Inventor Count = 5.5

ph-index = 3

Forward Citations = 15(Granted Patents)


Company Filing History:

goldMedal18 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 166,325 
 
International Business Machines Corporation
 patents

Years Active: 2017-2026

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20 patents (USPTO):Explore Patents
1. 12559362 - Micro-electro mechanical system and manufacturing method thereof (2026-02-24),
2. 12412857 - Hybrid micro-bump integration with redistribution layer (2025-09-09),
3. 12368120 - Semiconductor device and method (2025-07-22),
4. 12347722 - Semiconductor device structure with a protection cap at an end portion of a conductive line (2025-07-01),
5. 12266593 - Method of forming semiconductor device having at least one via including concave portions on sidewall (2025-04-01),
6. 12243837 - Semiconductor device and method (2025-03-04),
7. 12057423 - Bump integration with redistribution layer (2024-08-06),
8. 11955423 - Semiconductor device and method (2024-04-09),
9. 11942398 - Semiconductor device having at least one via including concave portions on sidewall (2024-03-26),
10. 11908790 - Chip structure with conductive via structure and method for forming the same (2024-02-20),
11. 11901266 - Semiconductor device structure and method for forming the same (2024-02-13),
12. 11862588 - Semiconductor device and method (2024-01-02),
13. 11855028 - Hybrid micro-bump integration with redistribution layer (2023-12-26),
14. 11855017 - Semiconductor device and method (2023-12-26),
15. 11851321 - Micro-electro mechanical system and manufacturing method thereof (2023-12-26),

Title: The Innovative Journey of Ting-Li Yang

Introduction: Ting-Li Yang, a pioneering inventor hailing from Tainan, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Ting-Li Yang holds several patents in various fields, including technology, healthcare, and sustainable energy. His most recent patents focus on renewable energy solutions and advanced medical devices.

Career Highlights: With a career spanning over two decades, Ting-Li Yang has worked tirelessly to bring his ideas to life. He has successfully brought several products to the market, revolutionizing industries along the way.

Collaborations: Throughout his career, Ting-Li Yang has collaborated with leading researchers, engineers, and scientists from around the globe. These collaborations have not only enriched his work but have also led to the development of innovative solutions to complex problems.

Conclusion: Ting-Li Yang's passion for innovation, coupled with his dedication to making a positive impact on society, sets him apart as a visionary inventor. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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