Shanghai, China

Ting Li

This inventor holds 30 USPTO granted patents and 31 published patent applications and 4 EPO patents, primarily in Wireless Communication. Top assignees: Huawei Technologies Co., Limited, Ademco Inc., International Business Machines Corporation. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting Li. Retrieved from https://idiyas.com/inventor/ting-li-rkmren0s

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 86.7

 

Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 53(Granted Patents)


Location History:

  • Nanjing, CN (2019)
  • Shenzhen, CN (2011 - 2022)
  • Hefei, CN (2022)
  • Shanghai, CN (2018 - 2023)

Company Filing History:


Years Active: 2011-2026

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Areas of Expertise:
Signal Processing
Security Sensors
Power Amplifiers
Integrated Circuit Design
Memory Device
Task Management
High Dielectric Material
Virtual Keyboard
Wireless System
Data Transmission
Channel Reporting
Mobile Station
30 patents (USPTO):Explore Patents

Title: Innovations and Achievements of Ting Li in Integrated Circuit Design

Introduction

Ting Li, an accomplished inventor based in Shanghai, China, boasts an impressive portfolio of 25 patents. His work primarily focuses on advancements in integrated circuit design, showcasing innovative solutions that enhance functionality and efficiency.

Latest Patents

Among his latest patents, Ting has developed a **Pattern-based Formal Description Language for Describing a Power/Ground Routing Structure in Integrated Circuit Design**. This innovative approach introduces a new power and ground structure description language (PSDL), allowing users to describe routing patterns for each layer on a user-defined regional basis. Unlike traditional methods that present a layer-by-layer view, the PSDL provides a comprehensive overview of the entire power and ground structure, facilitating better alignment and reducing the time-consuming trial-and-error process required by previous techniques. Furthermore, the PSDL’s flexibility makes it easy to transfer power and ground structures across different designs with minimal adjustments.

Another notable patent is for a **Tool-less Assembly Hard Disk Drive Bracket and Electronic Device**. This invention features a fixation rack and rotation rack that together provide a simple, convenient, and effective solution for assembling hard disk drives without the need for tools. The design emphasizes ease of installation and maintenance, making it both economical and practical.

Career Highlights

Ting Li has made significant contributions to the field of technology through his work with leading companies. He has held positions at **Huawei Technologies Co., Limited** and **Ademco Inc.**, where he applied his expertise in product design and development to create innovative solutions.

Collaborations

Throughout his career, Ting has collaborated with notable peers, including Liangliang Zhang and Lipeng Zhang. These partnerships have fostered a collaborative environment that has led to the development of cutting-edge technologies within the industry.

Conclusion

Ting Li's contributions to integrated circuit design and related technologies underscore his reputation as a visionary inventor. His patents not only streamline complex processes but also pave the way for future innovations in the field. With a commitment to advancing technology, Ting continues to inspire innovation and set new benchmarks in engineering excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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