Ting-Hwang Lin

Title: Innovations by Inventor Ting-Hwang Lin

Introduction

Ting-Hwang Lin is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of eight patents. His work focuses on improving manufacturing processes and enhancing the performance of semiconductor devices.

Latest Patents

Among his latest innovations is the "Dry etch endpoint method." This improved technique allows for more precise selection of etch endpoints when dry etching conductive material layers used in semiconductor device circuits. The method ensures that metallization patterns are free from residues caused by under-etching and avoids sidewall attack or pattern degradation resulting from over-etching. This innovation eliminates the need for costly and time-consuming pre-sorting of substrates based on product pattern density. Another notable patent is the "Upward plug filled via hole device." This method involves the manufacture of a semiconductor device on a silicon substrate, which includes the formation of multiple stress layers and an inter-metal dielectric layer. The process culminates in heating the device to effectively squeeze the metal interconnect layer into the via.

Career Highlights

Ting-Hwang Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approaches have significantly impacted the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

He has collaborated with notable coworkers, including Ying-Chen Chao and Chue-San Yoo, contributing to advancements in semiconductor technology.

Conclusion

Ting-Hwang Lin's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the industry and pave the way for future advancements.