Company Filing History:
8 out of 1,284 
1 out of 832,880 Years Active: 2011-2020
Title: Tiao Zhou – Innovator in Semiconductor Packaging
Introduction
Tiao Zhou, a prominent inventor based in Carrollton, Texas, has made significant strides in the field of semiconductor packaging with an impressive portfolio of nine patents. His work is especially notable for its innovative approaches to sensor packaging techniques.
Latest Patents
Among Tiao Zhou's latest patents are two particularly noteworthy inventions:
1. **Exposed Die Sensor Package**: This patent describes advanced packaging techniques for fabricating sensor packages that incorporate one or more sensor devices, including optical sensors or light sources. A key feature is that the active side of the sensor device is exposed, allowing for enhanced performance. Additionally, the sensor package boasts a substantially flat topology, measures less than about 75 µm, and is designed without wire bonding. The package interconnect is strategically placed on the opposite side of the sensor die.
2. **Pad Defined Contact for Wafer Level Package**: This innovation presents a set of fabrication techniques utilizing wafer-level packaging for semiconductor devices incorporating a pad defined contact. The package features a substrate, passivation layer, top metal contact pad, and a thin film with a via formed within it. The process involves several steps, including substrate processing and the creation of a dielectric layer on the thin film and redistribution layer structure.
Career Highlights
Tiao Zhou has contributed his expertise to various companies, including Maxim Integrated Products, Inc. His wealth of experience has allowed him to excel in the semiconductor industry, focusing on cutting-edge innovations in packaging technology.
Collaborations
Throughout his career, Tiao has had the opportunity to collaborate with renowned professionals in the field, such as Viren V Khandekar and Arkadii V Samoilov. These collaborations underscore the collaborative nature of technological advancements in the industry.
Conclusion
With a remarkable array of patents and a deep commitment to innovation, Tiao Zhou continues to impact the landscape of semiconductor packaging. His contributions not only advance technology but also serve as inspiration for future inventors in the industry.