The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Dec. 20, 2013
Applicant:

Maxim Integrated Products, Inc., San Jose, CA (US);

Inventor:

Tiao Zhou, Carrollton, TX (US);

Assignee:

Maxim Integrated Products, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); F21V 21/00 (2006.01); B32B 17/00 (2006.01); H01L 21/48 (2006.01); H01L 31/0203 (2014.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
F21V 21/00 (2013.01); B32B 17/00 (2013.01); H01L 21/4846 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/5389 (2013.01); H01L 25/167 (2013.01); H01L 31/0203 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 27/14618 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17515 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/831 (2013.01); H01L 2924/12042 (2013.01);
Abstract

In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board. In implementations, fabricating the sensor package device includes receiving a photodefinable glass-based substrate, etching the photodefinable glass-based substrate, and forming a ceramic portion of the photodefinable glass-based substrate.


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