The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Apr. 01, 2014
Applicant:

Maxim Integrated Products, Inc., San Jose, CA (US);

Inventor:

Tiao Zhou, Carrollton, TX (US);

Assignee:

Maxim Integrated Products, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
H01L 25/074 (2013.01); H01L 24/83 (2013.01); H01L 25/072 (2013.01); H01L 29/84 (2013.01);
Abstract

Packaging techniques are described for fabricating a flex sensor package that includes a flex printed circuit with a flex window, an adhesive layer with an adhesive layer window, and a stiffener assembly with a stiffener window on a first side of the flex printed circuit and a semiconductor die on a second side of the flex printed circuit. In implementations, fabricating the flex sensor package includes receiving a flex printed circuit including at least one flex window, placing an adhesive layer on at least a portion of a first side of the flex printed circuit, placing a stiffener assembly on the adhesive layer, and placing at least one semiconductor die on a second side of the flex printed circuit, where an active portion of the at least one semiconductor die is aligned with the at least one flex window and the adhesive layer window.


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Quick Actions:

Zhou, Tiao. (2016). Highly integrated flex sensor package (U.S. Patent No. 9356003). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9356003

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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