The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Sep. 27, 2013
Maxim Integrated Products, Inc., San Jose, CA (US);
Tiao Zhou, Carrollton, TX (US);
MAXIM INTEGRATED PRODUCTS, INC., San Jose, CA (US);
Abstract
Packaging techniques are described for fabricating an sensor package that include one or more sensor devices, such as optical sensors or light sources, where an active side of the sensor device is exposed. Additionally, the side of the sensor package including the sensor die is substantially flat (e.g., topology is less than about 75 μm), the sensor package does not include wire bonding, and the package interconnect (e.g., solder bump array or other connection) is disposed on a side of the sensor package opposite the sensor die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile