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Phoenix, AZ, United States of America

Tian-An Chen

This inventor holds 22 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Intel Corporation. Active years: 2004-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tian-An Chen. Retrieved from https://idiyas.com/inventor/tian-an-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 22

% Patents Active = 18.2

Average Co-Inventor Count = 2.6

ph-index = 6

Forward Citations = 79(Granted Patents)


Location History:

  • Chandler, AZ (US) (2004)
  • Phoenix, AZ (US) (2004 - 2013)

Company Filing History:

goldMedal22 out of 56,440 
 
Intel Corporation
 patents

Years Active: 2004-2013

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Areas of Expertise:
Semiconductor Structures
Thermal Expansion Resins
Underfill Materials
Flip-Chip Applications
Microelectronic Devices
Low Dielectric Layers
Soldered Packages
Nanopowder Coating
Fluxing Agents
Polybenzoxazine Film
Bumping Process
Chemical Vapor Deposition
22 patents (USPTO):Explore Patents
1. 8513111 - Forming semiconductor structures (2013-08-20),
2. 8431223 - Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications (2013-04-30),
3. 8242216 - Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications (2012-08-14),
4. 7999042 - Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications (2011-08-16),
5. 7718216 - Low temperature bumping process (2010-05-18),
6. 7619318 - No-flow underfill composition and method (2009-11-17),
7. 7504318 - Nanopowder coating for scribing and structures formed thereby (2009-03-17),
8. 7470564 - Flip-chip system and method of making same (2008-12-30),
9. 7303944 - Microelectronic devices having underfill materials with improved fluxing agents (2007-12-04),
10. 7279359 - High performance amine based no-flow underfill materials for flip chip applications (2007-10-09),
11. 7218007 - Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices (2007-05-15),
12. 7179684 - Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material (2007-02-20),
13. 7153765 - Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles (2006-12-26),
14. 7029723 - Forming chemical vapor depositable low dielectric constant layers (2006-04-18),
15. 7026376 - Fluxing agent for underfill materials (2006-04-11),

Title: Innovations and Contributions of Tian-An Chen in Semiconductor Technology

Introduction

Tian-An Chen, a notable inventor based in Phoenix, AZ, has made significant strides in the field of semiconductor technology. With an impressive portfolio of 22 patents, Chen's work reflects his commitment to advancing integrated circuit applications and improving semiconductor structures.

Latest Patents

Tian-An Chen's latest innovations include the development of a semiconductor structure that may be covered with a thermally decomposing film. This innovative approach allows for the subsequent formation of cavities, enhancing the efficiency of semiconductor devices. Additionally, his patent on low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications showcases his expertise. This technique involves a unique mixture of a curing agent dissolved in an epoxy resin to form a high-performing resin essential for modern electronics.

Career Highlights

Working at Intel Corporation, Tian-An Chen has established himself as a key player in the semiconductor industry. His contributions not only represent technological advancements but also highlight the importance of innovation in maintaining competitive advantage in the rapidly evolving landscape of technology.

Collaborations

Throughout his career, Chen has collaborated with esteemed coworkers such as Song-Hua Shi and Daoqiang Lu. Together, they have fostered an environment of creativity and innovation, leading to the development of groundbreaking technologies.

Conclusion

Tian-An Chen stands out as a prominent inventor whose patents and innovative solutions are shaping the future of semiconductor technology. His work exemplifies the impact of dedicated research and collaboration within the tech industry, particularly at a leading company like Intel Corporation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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