Location History:
- Fürth, DE (2014 - 2018)
- Fuerth, DE (2014 - 2019)
- Furth, DE (2013 - 2023)
Company Filing History:
10 out of 197 
3 out of 503 
2 out of 8 Years Active: 2013-2023
Title: Thomas Spann: Innovating Power Semiconductor Devices for Enhanced Thermal Transfer
Introduction:
In today's dynamic world of technological advancements, individuals like Thomas Spann contribute significantly to the field of power semiconductor devices. Hailing from Furth, Germany, Spann has earned recognition for his remarkable inventions and patents in improving thermal transfer efficiency. With an impressive portfolio of 13 patents, Spann has made remarkable contributions to the industry. Let's delve deeper into his latest patents, career highlights, collaborations, and the impact of his work in the field.
Latest Patents:
Thomas Spann's recent patents showcase his dedication to enhancing thermal transfer in power semiconductor devices. One notable invention is the "Heat Transfer Plate Having Small Cavities for Taking up a Thermal Transfer Material." This invention addresses the need for efficient thermal conduction by incorporating small cavities on the bottom surface of a bottom metal plate. By applying thermal grease, a phase change material (PCM), or solder in these cavities, the thermal transfer between the plate and other metal components significantly improves.
Another noteworthy patent is the "Power Semiconductor Device Module Having Mechanical Corner Press-fit Anchors." Spann recognized the need for secure module attachment without the use of screws or bolts. This innovation includes four mechanical corner press-fit anchors embedded into the plastic housing of the module. These anchors eliminate the need for additional fasteners and ensure an efficient and reliable connection with the printed circuit board.
Career Highlights:
During his career, Thomas Spann has worked with renowned companies in the power electronics industry. He contributed significantly to Ixys Corporation, a leading manufacturer of power semiconductors and integrated circuits. Spann's expertise and inventive abilities propelled him to collaborate with Littelfuse, Inc., a global supplier of circuit protection solutions. His contributions have helped these companies stay at the forefront of power semiconductor technology.
Collaborations:
Thomas Spann is known for his collaborative approach, working closely with professionals who share his passion for innovation. One of his notable colleagues is Holger Ostmann, a renowned expert in power electronics. Ostmann's expertise aligns seamlessly with Spann's focus on enhancing thermal transfer efficiency in power semiconductor devices. Another collaborator is Kang Rim Choi, whose insights and contributions have complemented Spann's inventions.
Conclusion:
Thomas Spann's inventive contributions and numerous patents in the field of power semiconductor devices highlight his dedicated pursuit of improving thermal transfer efficiency. His inventions, such as incorporating small cavities for thermal transfer materials and implementing mechanical corner press-fit anchors, showcase his innovative mindset and commitment to technological advancements. Through collaborations with notable colleagues like Holger Ostmann and Kang Rim Choi, Spann has contributed to the ongoing progress in the power electronics industry. As an esteemed inventor and advocate of technological innovation, Thomas Spann continues to shape the future of power semiconductor devices by optimizing thermal management for enhanced performance.