The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2023
Filed:
Aug. 31, 2021
Applicant:
Ixys Semiconductor Gmbh, Lampertheim, DE;
Inventors:
Yong Ai-Ong, Singapore, SG;
Thomas Spann, Furth, DE;
Assignee:
IXYS Semiconductor GmbH, Lampertheim, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/18 (2006.01); H01L 23/498 (2006.01); H01R 12/58 (2011.01);
U.S. Cl.
CPC ...
H01R 4/187 (2013.01); H01L 23/49811 (2013.01); H01R 12/58 (2013.01);
Abstract
Provided herein are semiconductor packages with improved electrical contacts (e.g. pins). In some embodiments, an assembly may include a substrate and an electrical contact coupled to the substrate, the electrical contact consisting of a first component defined by a complex 3D designed receiving pin. The electrical contact may further include a second component defined by another complex 3D designed penetrating pin, wherein the first component engages the second component to deform mechanically and to weld when the first component and the second component are coupled together.