This inventor holds 11 USPTO granted patents and 1 published patent application. Top assignees: Stats Chippac Pte. Ltd., Jcet Semiconductor (Shaoxing) Co., Ltd., Other. Active years: 1986-2024.
Location History:
- Tuscon, AZ (US) (2017)
- Tucson, AZ (US) (1986 - 2024)
Company Filing History:

Years Active: 1986-2024
Title: Thomas J Strothmann: Innovator in Semiconductor Technology
Introduction
Thomas J Strothmann is a prominent inventor based in Tucson, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His innovative work has advanced the development of semiconductor devices and packaging methods.
Latest Patents
Among his latest patents is a semiconductor device and method of making a wafer-level chip-scale package. This invention features a carrier with a fixed size, allowing for the placement of multiple semiconductor die independent of their size. The encapsulant is deposited around the die to form a reconstituted panel, which is then singulated. Another notable patent is for a method of forming an encapsulated wafer-level chip scale package (eWLCSP). This device includes a semiconductor die surrounded by an encapsulant, with a fan-in interconnect structure that remains within the footprint of the die. The innovative design allows for enhanced protection and alignment of the semiconductor die.
Career Highlights
Throughout his career, Thomas has worked with various companies, including Stats Chippac Pte. Ltd. His experience in the semiconductor industry has positioned him as a key player in the development of advanced packaging technologies.
Collaborations
Thomas has collaborated with notable professionals in the field, including Yaojian Lin and Seung Wook Yoon. Their combined expertise has contributed to the success of various projects and innovations in semiconductor technology.
Conclusion
Thomas J Strothmann's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of semiconductor devices and packaging methods.