The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Mar. 29, 2013
Applicant:
Stats Chippac, Ltd., Singapore, SG;
Inventors:
Thomas J. Strothmann, Tucson, AZ (US);
Steve Anderson, San Ramon, CA (US);
Byung Joon Han, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 27/14618 (2013.01); H01L 27/14683 (2013.01); H01L 21/56 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 2224/04105 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected to the conductive layer, whereby the interconnect structure is formed off to only one side of the semiconductor die.