Stats Chippac Pte. Ltd.

Other

Jcet Semiconductor (shaoxing) Co., Ltd.

Thomas J Strothmann

Yaojian Lin

Seung Wook Yoon

Il Kwon Shim

Pandi Chelvam Marimuthu

Heinz-Peter Wirtz

Damien M Pricolo

Heap Hoe Kuan

Byung Joon Han

Steve Anderson

A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.

Semiconductor device and method of making a wafer-level chip-scale package

A semiconductor device has a semiconductor die and an encapsulant around the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The fan-in interconnect structure includes an insulating layer and a conductive layer formed over the semiconductor die. The conductive layer remains within a footprint of the semiconductor die. A portion of encapsulant is removed from over the semiconductor die. A backside protection layer is formed over a non-active surface of the semiconductor die after depositing the encapsulant. The backside protection layer is formed by screen printing or lamination. The backside protection layer includes an opaque, transparent, or translucent material. The backside protection layer is marked for alignment using a laser. A reconstituted panel including the semiconductor die is singulated through the encapsulant to leave encapsulant disposed over a sidewall of the semiconductor die.

Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP)

Semiconductor device and method of using a standardized carrier in semiconductor packaging

Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)

A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected to the conductive layer, whereby the interconnect structure is formed off to only one side of the semiconductor die.

Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus

An electrical switch includes a housing and at least two electrical terminals. A pivoting toggle is provided within the housing for controlling the electrical connection between the two terminals. A light source is mounted to the housing in a fixed position and a length of optically conductive material extends from within the toggle to adjacent the light source, such that, when the light source is on, light is visible through the toggle via the optically conductive material.

Illuminated wall switch

Apparatus and method for determining a deviation of a body from a horizontal plane is disclosed. Attached to the body is a curved surface with a liquid conducting material moving freely thereon. Associated with the surface are electrodes at preselected positions and a surface at ground potential. As the liquid conducting material moves on the inner portion of the curved surface, the liquid conducting material provides a conducting path between the electrodes providing a resulting electrical activity such as a current flow. The electrical coupling of the electrodes is identified and the electrode(s) so activated identify a position on the curved surface and consequently when the curvature of the surface is known, a deviation from the horizontal plane can be determined. The position of the electrodes and the electrical structure thereof provide suitable signals for use by digital signal apparatus.

Level sensing apparatus providing output signals compatible with digital

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Tucson, AZ, United States of America

Thomas J Strothmann