Hyogo, Japan

Tetsuo Fukada


Average Co-Inventor Count = 4.0

ph-index = 7

Forward Citations = 148(Granted Patents)


Location History:

  • Tokyo, JP (1998 - 2001)
  • Hyogo, JP (2000 - 2002)

Company Filing History:


Years Active: 1998-2002

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8 patents (USPTO):Explore Patents

Title: Tetsuo Fukada: Innovator in Semiconductor Technology

Introduction

Tetsuo Fukada is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

Fukada's latest patents include innovative methods for semiconductor devices and their manufacturing processes. One notable patent describes a semiconductor device capable of preventing the diffusion of copper particles that form a conductive layer. This invention allows for the creation of a semiconductor device without increasing the number of manufacturing steps. Additionally, it addresses the challenge of preventing the diffusion of conductive layer particles into insulating layers, even when the width of the conductive layer is increased. Another significant patent outlines a method for forming a thin copper film on a titanium nitride (TiN) film, which is crucial for ensuring high adhesion and performance in semiconductor applications.

Career Highlights

Fukada is associated with Mitsubishi Electric Corporation, where he has been instrumental in advancing semiconductor technologies. His expertise in the field has led to numerous innovations that have improved the efficiency and effectiveness of semiconductor devices.

Collaborations

Throughout his career, Fukada has collaborated with notable colleagues, including Takeshi Mori and Yoshihiko Toyoda. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Tetsuo Fukada's contributions to semiconductor technology have made a lasting impact on the industry. His innovative patents and collaborative efforts continue to drive advancements in this critical field.

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