The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1999
Filed:
Dec. 03, 1996
Yoshihiko Toyoda, Tokyo, JP;
Takeshi Mori, Tokyo, JP;
Tetsuo Fukada, Tokyo, JP;
Makiko Hasegawa, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
To form a plurality of patterned conductor leads in the same layer of an integrated circuit, an insulating film is etched to form a plurality of patterned grooves by plasma etching using an etching gas containing carbon and fluorine to which an additive gas containing carbon is added. The etching rate is substantially proportional to the groove width, so that the groove depth is substantially proportional to the groove width. Grooves are filled with a conductive material to form patterned conductor leads. Thus, an aspect ratio of the patterned conductor leads is kept in a certain range, resulting in an improvement in yield and reliability of the conductor leads. The conductor leads formed of material containing copper are coated with a diffusion preventive film.