The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2001
Filed:
May. 14, 1998
Makiko Hasegawa, Tokyo, JP;
Yoshihiko Toyoda, Tokyo, JP;
Takeshi Mori, Tokyo, JP;
Tetsuo Fukada, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A method of preparing a multilevel embedded wiring system for an IC comprising a first wiring formation step, a first connecting portion formation step, and a second wiring formation step, wherein the first wiring formation step comprises forming a first trench for a first embedded wiring in a first insulating layer disposed on a substrate and embedding in the first trench, in turn, a first conductive layer and a first conductive capping layer; the first connecting portion formation step comprises forming a second insulating layer on the first insulating layer and the first conductive capping layer, forming a via-hole in a part of the second insulating layer at the first conductive capping layer, and embedding a conductive connecting portion in the via-hole and connected to the first conductive layer; and the second formation step comprises forming a third insulating layer on the second insulating layer and the conductive connecting portion, forming a second trench for a second wiring in the third insulating layer at the conductive connecting portion, and embedding a second conductive layer in the second trench and connected to the conductive connecting portion.