The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Apr. 30, 1999
Yoshihiko Toyoda, Hyogo, JP;
Tetsuo Fukada, Hyogo, JP;
Takeshi Mori, Hyogo, JP;
Yoshiyuki Kitazawa, Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A highly reliable semiconductor device having a contact hole with a sufficient area can be obtained. An interlevel insulating film is formed on a conductive region having a first width. A through hole which exposes the conductive region is formed at the interlevel insulating film. A coating film is formed on the interlevel insulating film. In the coating film, an opening having a second width larger than the first width is formed in a region located on the through hole. An interconnect line is formed in a region located on the opening. A conductor film for electrically connecting the conductive region and the interconnect line is generated within the through hole.