Tokyo, Japan

Tatsuya Kumada

USPTO Granted Patents = 4 

Average Co-Inventor Count = 4.1

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2022-2024

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4 patents (USPTO):Explore Patents

Title: Tatsuya Kumada: Innovator in Adhesive Technologies

Introduction

Tatsuya Kumada is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesive technologies, particularly in the context of connecting electronic members. With a total of 4 patents to his name, Kumada's work has garnered attention for its innovative approaches and practical applications.

Latest Patents

Kumada's latest patents include advancements in adhesive compositions used for connecting electronic members. One notable invention involves an adhesive composition that features a first conductive particle capable of penetrating an oxide film on an electrode's surface. Additionally, the second conductive particle in this composition has a nonconductive core body with a conductive layer. This innovative approach enhances the reliability and efficiency of electronic connections.

Career Highlights

Throughout his career, Tatsuya Kumada has worked with reputable companies such as Showa Denko Materials Co., Ltd. and Resonac Corporation. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and contribute to various projects that push the boundaries of innovation.

Collaborations

Kumada has collaborated with notable professionals in his field, including Tetsuyuki Shirakawa and Takahiro Fukui. These collaborations have fostered a creative environment that has led to the development of groundbreaking adhesive solutions.

Conclusion

Tatsuya Kumada's contributions to adhesive technologies exemplify the spirit of innovation. His patents and collaborations reflect a commitment to advancing the field and improving electronic connections. His work continues to inspire future developments in adhesive applications.

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