The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Feb. 14, 2018
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Tetsuyuki Shirakawa, Tokyo, JP;

Hiroyuki Izawa, Tokyo, JP;

Tatsuya Kumada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C08K 3/08 (2006.01); C09J 11/04 (2006.01); C09J 201/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C08K 3/08 (2013.01); C09J 11/04 (2013.01); C09J 201/00 (2013.01); C08K 2003/0831 (2013.01); C08K 2003/0862 (2013.01); C08K 2201/001 (2013.01); C09J 2203/326 (2013.01); C09J 2400/16 (2013.01);
Abstract

One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.


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