The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Aug. 01, 2022
Applicant:

Showa Denko Materials Co., Ltd, Tokyo, JP;

Inventors:

Tetsuyuki Shirakawa, Tokyo, JP;

Satoru Matsumoto, Tokyo, JP;

Yusuke Asakawa, Tokyo, JP;

Tatsuya Kumada, Tokyo, JP;

Takahiro Fukui, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 7/00 (2018.01); C09J 163/00 (2006.01); C09J 175/16 (2006.01); C09J 201/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 7/00 (2013.01); C09J 163/00 (2013.01); C09J 175/16 (2013.01); C09J 201/00 (2013.01);
Abstract

One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.


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