Tatsumi Kusaba

Title: **Tatsumi Kusaba: Innovator in Wafer Production Technologies**

Introduction

Tatsumi Kusaba is a prolific inventor based in Tokyo, Japan, known for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 16 patents, Kusaba has established himself as a key figure in the innovation and development of wafer production methods.

Latest Patents

Kusaba's latest patents showcase his innovative approach to enhancing wafer production processes. One of his notable inventions is a **Method for Producing a Bonded Wafer**. This method involves bonding a wafer for the active layer with a support layer, followed by thinning the active layer wafer. A crucial step in this process is the implantation of oxygen ions into the active layer wafer while maintaining a temperature below 200°C, under a specific dosage, resulting in a bonded wafer with exceptional thickness uniformity and improved surface roughness.

Another significant contribution is the **P-type Silicon Wafer and Method for Heat-Treating the Same**. This patent outlines a heat treatment process for p-type silicon wafers that achieves a resistivity of 10 Ω·cm or greater and an enhanced defect density. The method entails a precise sequence of loading the wafers, heat treatment in an argon gas atmosphere at elevated temperatures, and efficient transfer of wafers, thereby optimizing the production process.

Career Highlights

Kusaba is currently associated with **Sumco Corporation**, where he continues to lead advancements in silicon wafer technologies. His work is instrumental in meeting the increasing demand for high-quality semiconductor materials, critical for various electronic applications.

Collaborations

Throughout his career, Tatsumi Kusaba has collaborated with esteemed colleagues such as Akihiko Endo and Hidehiko Okuda. Together, they have focused on pushing the boundaries of semiconductor manufacturing, harnessing their collective expertise to drive innovation in the industry.

Conclusion

In summary, Tatsumi Kusaba's impactful inventions and dedicated career in semiconductor technology, particularly in wafer production, exemplify the essence of innovation in today's fast-paced technological landscape. His work not only enhances the quality of wafers but also contributes significantly to the advancement of semiconductor applications worldwide.