Chiba, Japan

Takuya Nakaue


Average Co-Inventor Count = 5.8

ph-index = 1


Company Filing History:


Years Active: 2008-2011

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2 patents (USPTO):

Title: Takuya Nakaue: Innovator in Micro-Machining Technology

Introduction

Takuya Nakaue is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of micro-machining, holding two patents that showcase his innovative approach to technology. His work focuses on enhancing the efficiency and effectiveness of micro-machining processes.

Latest Patents

Nakaue's latest patents include a micro-machining dust removing device and a micro-machining apparatus. The micro-machining apparatus is designed to remove dust generated during machining while a workpiece is processed within a liquid using a probe tip. This apparatus features a stage for the workpiece, a probe with a tip, and a machining device that allows for relative movement between the stage and the probe. Additionally, the micro-machining dust removing device incorporates electrodes arranged in the liquid to facilitate the movement of dust through voltage application. His working method using a scanning probe enhances working speed and prolongs the probe's lifespan by allowing relative scanning at predetermined speeds while vibrating the probe.

Career Highlights

Throughout his career, Takuya Nakaue has worked with prominent organizations such as Sii Nanotechnology Inc. and Shizuoka University. His experience in these institutions has contributed to his expertise in micro-machining technologies and applications.

Collaborations

Nakaue has collaborated with notable colleagues, including Masatoshi Yasutake and Osamu Takaoka. These partnerships have likely enriched his research and development efforts in the field of micro-machining.

Conclusion

Takuya Nakaue's contributions to micro-machining technology through his patents and collaborations highlight his role as an innovator in this specialized field. His work continues to influence advancements in micro-machining processes and applications.

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