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For the Inventor, By the Inventor

Nagano, Japan

Takeshi Sato

This inventor holds 6 USPTO granted patents. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 1982-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takeshi Sato. Retrieved from https://idiyas.com/inventor/takeshi-sato-0l4i8b6h

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 6

% Patents Active = 83.3

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 57(Granted Patents)


Company Filing History:

goldMedal6 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents

Years Active: 1982-2003

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6 patents (USPTO):Explore Patents
1. 6577000 - Premold type semiconductor package (2003-06-10),
2. 6333211 - Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps (2001-12-25),
3. 6097101 - Package for semiconductor device having frame-like molded portion and (2000-08-01),
4. 4969257 - Transfer sheet and process for making a circuit substrate (1990-11-13),
5. 4867839 - Process for forming a circuit substrate (1989-09-19),
6. 4345372 - Method of producing a multicontact spring (1982-08-24),

Title: The Innovations of Takeshi Sato

Introduction

Takeshi Sato is a prominent inventor based in Nagano, Japan. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work has been instrumental in advancing technology in this area.

Latest Patents

One of his latest patents is for a premold type semiconductor package. This innovative package includes a plurality of leads arranged side by side, featuring upper and lower common surfaces. The mold resin is integrally molded with the leads, securing them from both surfaces. It defines a chip mounting recess on the upper side of the leads, allowing a semiconductor chip to be mounted within the recess. The upper surfaces of the leads are partially exposed, creating internal connecting terminals for electrical connections to the semiconductor chip. Additionally, the mold resin has multiple holes that expose the lower surfaces of the leads, defining external connecting terminals.

Another notable patent involves a process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps. This patent shares similar features with the previous one, emphasizing the innovative design and functionality of the semiconductor package.

Career Highlights

Takeshi Sato has been associated with Shinko Electric Industries Co., Ltd., where he has contributed to various projects and advancements in semiconductor technology. His expertise and innovative mindset have made him a valuable asset to the company.

Collaborations

Throughout his career, Sato has collaborated with notable coworkers, including Kenichi Sakaguchi and Hiromi Tokunaga. These collaborations have fostered a creative environment that has led to significant advancements in their field.

Conclusion

Takeshi Sato's contributions to semiconductor packaging through his patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and pave the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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