The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2003
Filed:
Dec. 18, 2001
Shinko Electric Industries Co., Ld., Nagano, JP;
Abstract
A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.