This inventor holds 4 USPTO granted patents. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 1999-2003.
Company Filing History:
Years Active: 1999-2003
Title: Kenichi Sakaguchi: Innovator in Semiconductor Packaging
Introduction
Kenichi Sakaguchi is a prominent inventor based in Nagano, Japan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative designs have advanced the technology used in semiconductor manufacturing.
Latest Patents
One of his latest patents is for a premold type semiconductor package. This package includes a plurality of leads arranged side by side, featuring upper and lower common surfaces. The mold resin is integrally molded with the leads, securing them from both surfaces. It defines a chip mounting recess on the upper side of the leads, allowing a semiconductor chip to be mounted within the recess. The upper surfaces of the leads are partially exposed, creating internal connecting terminals for electrical connections to the semiconductor chip. Additionally, the mold resin has multiple holes that expose the lower surfaces of the leads, defining external connecting terminals.
Another notable patent involves a process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps. This design shares similarities with his previous patent, emphasizing the innovative approach to semiconductor packaging.
Career Highlights
Kenichi Sakaguchi is currently employed at Shinko Electric Industries Co., Ltd. His work at this company has allowed him to collaborate with other talented professionals in the field, further enhancing his contributions to semiconductor technology.
Collaborations
Some of his notable coworkers include Takeshi Sato and Hiromi Tokunaga. Their collaborative efforts have played a crucial role in the development of advanced semiconductor packaging solutions.
Conclusion
Kenichi Sakaguchi's work in semiconductor packaging has led to significant advancements in the industry. His innovative patents and collaborations with skilled professionals continue to shape the future of semiconductor technology.