The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2000
Filed:
Jan. 29, 1999
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
The object of the present invention is to provide a premolded-type package for a semiconductor device which can be produced easily and exhibits a good airtightness, and to provide a method for effectively producing the same. A package for a semiconductor device has a wiring substrate 32 having a resin substrate 35 which is provided on its one surface with a wiring pattern 37, a chip-mounting portion 36 and a frame-like pattern 38 of a metal surrounding the wiring pattern 37 and the chip-mounting portion 36, and on the other surface with a plurality of terminals 41 electrically connected to the wiring pattern, and a frame-like molded portion 45 of thermosetting resin, molded on the frame-like pattern 38 on the wiring substrate 32.