Tokyo, Japan

Takao Kamoshima

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Hyogo, JP (2001 - 2003)
  • Tokyo, JP (2003 - 2012)
  • Hitachinaka, JP (2019)

Company Filing History:


Years Active: 2001-2019

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6 patents (USPTO):Explore Patents

Title: Takao Kamoshima: Innovator in Semiconductor Technology

Introduction

Takao Kamoshima is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His innovative work focuses on improving the reliability and efficiency of semiconductor devices.

Latest Patents

Kamoshima's latest patents include a semiconductor device and a method of manufacturing the same. This invention addresses the issue of voids in interlayer insulating films on semiconductor substrates. It prevents short circuits between contact plugs by utilizing a conductive film buried in the void during the formation of the contact plugs. Additionally, he has developed a semiconductor device featuring metal contacts formed in an interlayer dielectric film comprising four silicon-containing layers. This design enhances the reliability of semiconductor devices with embedded wires.

Career Highlights

Throughout his career, Kamoshima has worked with notable companies such as Mitsubishi Electric Corporation and Renesas Electronics Corporation. His experience in these organizations has allowed him to refine his expertise in semiconductor technology and contribute to various innovative projects.

Collaborations

Kamoshima has collaborated with talented individuals in the field, including Takashi Yamashita and Takeru Matsuoka. These collaborations have further enriched his work and led to advancements in semiconductor technology.

Conclusion

Takao Kamoshima is a distinguished inventor whose contributions to semiconductor technology have made a lasting impact. His innovative patents and collaborations reflect his commitment to advancing the field.

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