Handa, Japan

Takaharu Iwadachi



Average Co-Inventor Count = 1.7

ph-index = 5

Forward Citations = 56(Granted Patents)


Location History:

  • Handa City, JP (1990)
  • Handa, JP (1987 - 2004)

Company Filing History:


Years Active: 1987-2004

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11 patents (USPTO):Explore Patents

Title: The Innovations of Takaharu Iwadachi in Beryllium and Copper Alloy Bonding

Introduction

Takaharu Iwadachi is a prominent inventor based in Handa, Japan, renowned for his significant contributions to the field of materials science. With a total of 11 patents to his name, he has made remarkable strides in developing innovative methods for bonding beryllium and copper or copper alloys. His pioneering work enhances both bonding strength and thermal cycle resistance, essential for various industrial applications.

Latest Patents

Among Takaharu Iwadachi's latest patents is a groundbreaking invention titled "Bonded body comprising beryllium member and copper or copper alloy member, and method of manufacturing the same." This invention details an improved method for producing a bonded body by utilizing a diffusion inhibition layer formed from titanium, chromium, molybdenum, or silicon on the beryllium surface, followed by a bonding layer of copper and a bonding promotion layer of aluminum or zinc. This innovative approach significantly enhances bonding strength and thermal properties.

Another notable patent is the "Method of manufacturing beryllium-copper alloy hot isostatic press (HIP) bonded body and HIP-bonded body." This patent describes a unique process where a diffusion inhibiting layer is deposited on the copper alloy before hot isostatic pressing, further improving the bonding properties. An aluminum-magnesium alloy insert plays a crucial role during this HIP bonding step, showcasing Iwadachi's innovative techniques in the field.

Career Highlights

Takaharu Iwadachi's career has been marked by his dedication to materials engineering at NGK Insulators, Inc. His work consistently pushes the boundaries of what is possible in bonding technologies. His achievements in patenting his inventions illustrate his commitment to advancing industry standards and practices in material bonding, particularly with beryllium-copper alloys.

Collaborations

Throughout his career, Takaharu has collaborated with noted colleagues such as Kazuo Ikushima and Yosuke Matsui. These partnerships have contributed to the success of his projects and furthered the collective expertise in the field, demonstrating the importance of teamwork in driving innovation.

Conclusion

Takaharu Iwadachi stands out as a visionary inventor whose contributions to the field of beryllium and copper alloy bonding have set new benchmarks in material science. His 11 patents reflect his dedication to innovation and excellence, cementing his status as a key figure in advancing bonding methodologies essential for various applications. As the industry evolves, Iwadachi’s work promises to influence future developments and inspire a new generation of inventors.

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